Glossary entry (derived from question below)
Chinese term or phrase:
晶圆级封
English translation:
Wafer Level Chip Scale Packaging
Added to glossary by
Suzanne Reynolds
Oct 1, 2023 22:54
7 mos ago
12 viewers *
Chinese term
United Kingdom
晶圆级封
Chinese to English
Bus/Financial
Automotive / Cars & Trucks
盛美上海从事对先进集成电路制造与先进晶圆级封装制造行业至关重要的单晶圆及槽式湿法清洗设备、电镀设备、无应力抛光设备、立式炉管设备和前道涂胶显影设备和等离子体增强化学气相沉积设备等的开发、制造和销售等。
In particular it's the jifeng I'm not sure about. It seems to be a specialised set term which I'm unfamiliar with.
Thanks.
In particular it's the jifeng I'm not sure about. It seems to be a specialised set term which I'm unfamiliar with.
Thanks.
Proposed translations
(English)
| 4 | Wafer Level Chip Scale Packaging |
pkchan
|
| 5 | Wafer Level Packaging，（晶圆级封装） |
Kiet Bach
|
Proposed translations
5 days
Selected
Wafer Level Chip Scale Packaging
WLCSP晶圆级芯片封装技术 - 每日E问
eteforum.com
https://www.eteforum.com › article
Mar 13, 2023 — WLCSP（Wafer Level Chip Scale Packaging）即晶圆级芯片封装方式，不同于传统的芯片封装方式（先切割再封测，而封装后至少增加原芯片20%的体积），此种 ...
晶圆级封装顺应时代趋势_技术
Sohu
https://www.sohu.com › ...
Aug 28, 2021 — 事实上，这个英文缩写是晶圆片级芯片规模封装（Wafer Level Chip Scale Packaging）的简称，作为国内率先进入先进封装行业的领头企业，这个缩写代表了晶方 ...
4 KudoZ points awarded for this answer.
Comment: "Thanks, PK."
37 mins
Wafer Level Packaging，（晶圆级封装）
什么是晶圆级封装？晶圆级封装之五大技术要素
晶圆级封装(Wafer Level Packaging，缩写WLP)是一种先进的封装技术，因其具有尺寸小、电性能优良、散热好、成本低等优势，近年来发展迅速。根据Verified Market Research 研究数据，晶圆级封装市场 2020 年为 48.4 亿美元，预计到 2028 年将达到 228.3 亿美元，从 2021 年到2028 年的复合年增长率为 21.4%。
https://www.sumzi.com/englishnew/news_info.aspx?id=10322
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Note added at 1 hr (2023-10-02 00:05:50 GMT)
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晶圆(wafer) 级(level) 封装(packaging)
晶圆级封装(Wafer Level Packaging，缩写WLP)是一种先进的封装技术，因其具有尺寸小、电性能优良、散热好、成本低等优势，近年来发展迅速。根据Verified Market Research 研究数据，晶圆级封装市场 2020 年为 48.4 亿美元，预计到 2028 年将达到 228.3 亿美元，从 2021 年到2028 年的复合年增长率为 21.4%。
https://www.sumzi.com/englishnew/news_info.aspx?id=10322
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Note added at 1 hr (2023-10-02 00:05:50 GMT)
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晶圆(wafer) 级(level) 封装(packaging)
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