A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) through processes such as photolithography. The wafer is cut into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms: dice, dies, and die.[1][2]
http://www.google.de/search?hl=de&as_qdr=all&q=silicone die&...

die pl.: dies, rarely: dice [engin.] der Rohchip
http://dict.leo.org/ende?lp=ende&lang=de&searchLoc=0&cmpType...

We could provide products from most major semiconductor manufacturers around world. Such as: AD, NS, TI, IR, Intersil, ATMEL, FCH, ON, LT, MAXIM, and MIC etc. Our inventory includes discrete component and integrated circuit, even obsolescent dice, for we are a genuine established semiconductor die bank.
http://www.sunytec.com/english/gsgk.asp

Der Blick auf den Rohchip ("Die"; hier von Intel) verrät, dass bei den Vier-Kern-CPUs der ersten Generation zwei Dual-Core-Prozessoren nebeneinander platziert werden.
http://www.computerwoche.de/knowledge_center/notebook_pc/586...

In the microelectronics industry, there are Known-Good-Die (KGD) chips, which are die (chips) that have been tested and burned-in, and are known to be good prior to sale. Moreover, it is necessary that chips used to populate a multi-chip module (MCM) be (KGD) chips prior to being placed on the MCM, so that it is not necessary to reflow the module excessive times to replace die (chips) that may be defective.

One method of producing KGD chips is to test the die on an Alumina Based Ceramic carrier. The Alumina Based Ceramic carrier can be a standard single-chip substrate. If the tested die is found to be good, the die is removed and put in a Known-Good-Die bank. The Alumina Based Ceramic, standard single-chip substrate is then cleaned and re-used.
http://www.freshpatents.com/Temporary-chip-attach-using-inje...

The cost of stocking silicon in a bare die bank is far less than the cost of stocking packaged parts which include the costs of package, assembly and test.
http://www.mintech.co.uk/ProdServ/die_banking.aspx

bank = Speicherbank, Lager, Magazin, Depot.